EP2A40F672C7ES vs EP2A40F672C8N Comparación
Comparación detallada lado a lado de EP2A40F672C7ES por Intel y EP2A40F672C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F672C7ES | EP2A40F672C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $124,75 | $122,00 |
| Family | APEX II | APEX II |
| Logic Elements | 38400 | — |
| Typical Gates | 1.5 M | — |
| Maximum Logic Elements | 40960 | — |
| Maximum Macro Cells | 2560 | — |
| Maximum User I/O | 492 | — |
| Maximum Operating Frequency | 562 MHz | 376 MHz |
| Process Technology | 0.15 µm CMOS | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 3.3 V | — |
| Encapsulado | 672-pin FC-FBGA (FineLine BGA) | — |
| Package Dimensions | 27 × 27 mm | 27 x 27 mm |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Speed Grade | 7 | C8 |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | — |
| Status Code | ES (Engineering Sample) | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Series | — | EP2A40 |
| Logic Family | — | CMOS |
| System Gates | — | 1.5 M |
| Logic Elements / Cells | — | 38,400 |
| Propagation Delay | — | 1.55 ns |
| Technology Node | — | 0.15 µm |
| Process Feature | — | All-layer copper, up to 8 metal layers |
| Nominal Supply Voltage (VCCINT) | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 492 |
| Number of Pins / Balls | — | 672 |
| Package Type | — | FC-FBGA (FineLine BGA) |
| LVDS Data Rate | — | 1 Gbps |
| Embedded PLLs | — | 4 |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| Operating Temperature (Commercial) | — | 0 °C to 85 °C |