EP2A40F672C8 vs EP2A40F672C9N Comparación
Comparación detallada lado a lado de EP2A40F672C8 por Intel y EP2A40F672C9N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F672C8 | EP2A40F672C9N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $68,00 | $295,00 |
| Family | APEX II | APEX II |
| Logic Family | CMOS | CMOS (SRAM-based configuration) |
| Typical Logic Elements (LEs) | 40,000 | — |
| Embedded Memory | Up to 1.5 Mbits | — |
| User I/Os | 492 pins | 492 |
| Número de pines | 672 | — |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch | — |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper, up to 8 metal layers |
| Propagation Delay (speed grade C8) | 1.55 ns | — |
| Temperatura de funcionamiento | 0 C to 85 C (commercial) | 0 °C to +85 °C (commercial) |
| Phase-Locked Loops (PLLs) | 4 | — |
| LVDS Signaling Support | Up to 1 Gbps | — |
| Multipliers | Embedded multiplier blocks | — |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Device Name | — | EP2A40 |
| System Gates | — | 1,500,000 |
| Logic Elements | — | 38,400 |
| Embedded RAM (ESB) | — | [DATA_NEEDED: ESB total RAM bits] |
| Encapsulado | — | BGA-672 (27 x 27 mm, 1.0 mm pitch) |
| Package Code | — | FC-FBGA / PBGA672 |
| Speed Grade | — | C9 (~1.55 ns propagation delay) |
| Core Voltage | — | 1.5 V |
| Internal Frequency | — | 366 MHz |
| LVDS Data Rate | — | 1 Gbps |
| Propagation Delay | — | 1.55 ns |
| Estado RoHS | — | [DATA_NEEDED: RoHS compliance status] |