EP2A40F672C9N vs EP2A40F672C8 Comparación
Comparación detallada lado a lado de EP2A40F672C9N por Intel y EP2A40F672C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F672C9N | EP2A40F672C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $295,00 | $68,00 |
| Family | APEX II | APEX II |
| Device Name | EP2A40 | — |
| System Gates | 1,500,000 | — |
| Logic Elements | 38,400 | — |
| User I/Os | 492 | 492 pins |
| Embedded RAM (ESB) | [DATA_NEEDED: ESB total RAM bits] | — |
| Encapsulado | BGA-672 (27 x 27 mm, 1.0 mm pitch) | — |
| Package Code | FC-FBGA / PBGA672 | — |
| Speed Grade | C9 (~1.55 ns propagation delay) | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15-micron all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V | — |
| Internal Frequency | 366 MHz | — |
| LVDS Data Rate | 1 Gbps | — |
| Propagation Delay | 1.55 ns | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | 0 C to 85 C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Logic Family | CMOS (SRAM-based configuration) | CMOS |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Typical Logic Elements (LEs) | — | 40,000 |
| Embedded Memory | — | Up to 1.5 Mbits |
| Número de pines | — | 672 |
| Package Type | — | FineLine BGA, 27 x 27 mm, 1.0 mm pitch |
| Propagation Delay (speed grade C8) | — | 1.55 ns |
| Phase-Locked Loops (PLLs) | — | 4 |
| LVDS Signaling Support | — | Up to 1 Gbps |
| Multipliers | — | Embedded multiplier blocks |
| I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |