EP2A70F1508C9 vs EP2A70F1508I-9 Comparación
Comparación detallada lado a lado de EP2A70F1508C9 por Intel y EP2A70F1508I-9 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Última compraIntel
EP2A70F1508I-9 - APEX II FPGA 70K LE, FBGA-1508 | Altera / Intel
EP2A70F1508I-9 ⚠ Última compraComparación de especificaciones
| Parámetro | EP2A70F1508C9 | EP2A70F1508I-9 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.310,00 | $195,00 |
| Series | APEX II | — |
| Family | APEX II FPGA | APEX II (EP2A) |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | — |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | — |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| Tipo de montaje | Surface Mount | — |
| Encapsulado / Carcasa | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| Temperatura de funcionamiento | 0 °C to 85 °C | -40C to +100C (Industrial, suffix I) |
| Speed Grade | C9 | -9 (fastest APEX II speed grade) |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.18 um CMOS, SRAM-based |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | — |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per data] |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Device Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Typical Gates | — | 70,000 |
| Maximum User I/O Pins | — | [DATA_NEEDED: maximum user I/O] |
| Maximum User Memory Bits | — | [DATA_NEEDED: embedded RAM bits] |
| Encapsulado | — | 1508-ball FBGA (FineLine BGA) |
| Configuration Method | — | SRAM-based, in-system reprogrammable |
| On-chip Memory | — | Embedded System Blocks (ESBs) - dual-port RAM/ROM |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, LVPECL |
| Differential I/O | — | True-LVDS capable |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 220 C |
| Design Software | — | Quartus II (legacy APEX II support) |