EP2AGX125EF29C5G vs EP2AGX125EF29I5G Comparación
Comparación detallada lado a lado de EP2AGX125EF29C5G por Intel y EP2AGX125EF29I5G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX125EF29C5G | EP2AGX125EF29I5G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.090,00 | $861,62 |
| Family | Arria II GX | Arria II GX |
| Series | Arria II GX | — |
| Logic Elements (LE) | 118,143 | — |
| Adaptive Logic Modules (ALM) | 49,600 | — |
| Embedded Memory Bits | 8,315,904 | 8,315,904 |
| M9K Block RAM Blocks | 730 | — |
| MLAB Memory | 1,512 Kbits | — |
| 18x18 Multipliers | 590 | — |
| User I/Os | 372 | — |
| I/O Banks | 12 | — |
| Transceiver Channels | 8 | — |
| Transceiver Data Rate (max) | 3.75 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | — |
| Speed Grade | C5 (commercial) | — |
| Encapsulado | 780-FBGA (FCBGA, 29x29 mm, 1.0 mm pitch) | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Logic Elements | — | 118,143 |
| User I/O Pins | — | 372 |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |