EP2AGX190FF35I5N vs EP2AGX190FF35C5G Comparación
Comparación detallada lado a lado de EP2AGX190FF35I5N por Intel y EP2AGX190FF35C5G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2AGX190FF35C5G - 181165 LE Arria II GX FPGA, 612 I/O, FC-FBGA-1152 | Intel / Altera
EP2AGX190FF35C5G ✓ ActivoComparación de especificaciones
| Parámetro | EP2AGX190FF35I5N | EP2AGX190FF35C5G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.605,00 | $1.245,00 |
| Device Family | Arria II GX | — |
| Logic Elements | 181165 | — |
| Adaptive Logic Modules (ALMs) | 7612 | — |
| User I/Os | 612 | — |
| Embedded Memory (Kbits) | 10177.536 | — |
| Number of Transceivers | Up to 16 | — |
| Transceiver Data Rate | Up to 3.75 Gbps | — |
| Core Supply Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Package Type | 1152-ball FC-FBGA (FF35) | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Pin/Pitch Configuration | [DATA_NEEDED: ball pitch and pin map] | — |
| Hard Memory Controllers | Yes | — |
| Hard PCI Express Blocks | Yes (Gen1) | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: count] | — |
| PLLs | Up to 8 | 4 |
| Estado RoHS | Compliant | Compliant |
| Family | — | Arria II GX |
| Logic Elements (LE) | — | 181,165 |
| Adaptive Logic Modules (ALM) | — | 71,510 |
| Embedded Memory (M9K blocks) | — | 1,118 |
| Embedded Memory (total) | — | 9,594 Kbits (10,123,008 bits) |
| MLAB Memory | — | 1.2 Mbits |
| DSP Blocks (18x18 multipliers) | — | 840 |
| Transceivers | — | 8 channels |
| Transceiver Data Rate (max) | — | 3.75 Gbps |
| Maximum User I/O Pins | — | 612 |
| Memory Controllers | — | 4 (hard IP) |
| Core Voltage | — | 0.9 V |
| I/O Voltage Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Node | — | 40 nm |
| Encapsulado | — | 1152-ball FC-FBGA (FF35) |
| Speed Grade | — | C5 (commercial, mid-performance) |
| Operating Temperature (commercial) | — | 0C to +85C |
| Tipo de montaje | — | Surface Mount (BGA) |