EP2AGX260EF29C5N vs EP2AGX260EF29C6N Comparación
Comparación detallada lado a lado de EP2AGX260EF29C5N por Intel y EP2AGX260EF29C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX260EF29C5N | EP2AGX260EF29C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.565,00 | $1.395,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II GX | — |
| Logic Elements (LE) | 244,188 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 10,238 Kbit | — |
| Number of LABs/CLBs | 10,260 | 10260 |
| Number of Logic Cells | 244,188 | — |
| Number of I/O | 372 | 372 |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate | Up to 5 Gbps | — |
| PLL Count | 8 (4 enhanced + 4 fast PLLs) | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Voltage | 0.9 V | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (Commercial) | 0C to +85C (commercial, C6 speed grade) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | [DATA_NEEDED: MSL level] | 3 |
| Estado RoHS | Compliant (per DigiKey listing) | — |
| Logic Elements | — | 244188 |
| Total Memory Bits | — | 12038144 |
| Voltage - Supply | — | 0.9 V core |
| Encapsulado / Carcasa | — | 780-BBGA, FCBGA (29 x 29 mm) |
| Lead Free | — | Yes |
| JEDEC Standard | — | MS-034 |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Up to 16 GXB channels at 6.375 Gbps |
| Tipo de memoria | — | M9K + MLAB (mixed) |
| Hard IP | — | PCIe Gen2 x1/x2/x4, DDR3 PHY |
| Supplier Device Package | — | 780-FBGA (FC-FBGA) |