EP2AGX260EF29I3N vs EP2AGX260EF29I5N Comparación
Comparación detallada lado a lado de EP2AGX260EF29I3N por Altera y EP2AGX260EF29I5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP2AGX260EF29I3N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel (Altera)
EP2AGX260EF29I3N NrndComparación de especificaciones
| Parámetro | EP2AGX260EF29I3N | EP2AGX260EF29I5N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.120,00 | $1.950,00 |
| Series | Arria II GX | Arria II GX |
| Manufacturer | Intel (formerly Altera) | — |
| Family | Arria II GX | Arria II |
| Logic Elements (LE) | 244,188 | — |
| Logic Array Blocks (LABs) | 10,260 | — |
| Embedded Memory | 12,038,144 bits | — |
| Total Block RAM | 8.7 Mbit (M20K blocks) | — |
| DSP Blocks / 18x18 Multipliers | [DATA_NEEDED: DSP block count] / 1,023 (max) | — |
| Maximum User I/O | 372 | 372 |
| Transceiver Channels | 12 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | CMOS |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial) | — |
| Encapsulado | 780-ball FCBGA / 780-BBGA | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Hard IP | PCIe Gen2 endpoint, DDR2/DDR3 PHY | — |
| Logic Elements | — | 244,188 |
| Adaptive Logic Modules (ALMs) | — | 10260 LABs |
| Embedded Memory Bits | — | 12,038,144 bits |
| Number of I/O | — | 372 |
| Number of Transceivers | — | 12 |
| Transceiver Data Rate (CPLL) | — | up to 3.75 Gbps |
| Transceiver Data Rate (Channel PLL) | — | up to 5 Gbps |
| 18x18 Multipliers | — | 1,152 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | 5 |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip BGA) |
| Package Dimensions | — | 29 mm x 29 mm |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Lead Free | — | Yes |
| Configuration | — | JTAG / passive serial / fast passive parallel |