EP2AGX260FF35C5N vs EP2AGX260FF35C4N Comparación
Comparación detallada lado a lado de EP2AGX260FF35C5N por Intel y EP2AGX260FF35C4N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX260FF35C5N | EP2AGX260FF35C4N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.545,00 | $3.125,00 |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 244,188 | — |
| Embedded Memory (bits) | 12,038,144 | — |
| Logic Array Blocks (LABs) | 10,260 | — |
| 18x18 Hardware Multipliers | 736 | — |
| User I/O Count | 612 | — |
| Transceiver Channels | 48 | 8 |
| Maximum Transceiver Data Rate | 3.75 Gbps | — |
| PLLs | 8 (4 fractional, 4 general-purpose) | — |
| Process Node | 40 nm | — |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | Commercial (0C to +85C) |
| Encapsulado | 1152-FBGA (Flip-Chip BGA), 35x35 mm | 1152-ball FC-FBGA |
| Tipo de montaje | Surface Mount | Surface Mount (SMT) |
| Estado RoHS | Lead Free (Compliant per data sheet) | [DATA_NEEDED: RoHS status] |
| Tensión de alimentación | 0.9 V core (typical) | — |
| Speed Grade | C5 | -4 |
| Logic Elements (LE) | — | 244,188 |
| Embedded Memory Bits | — | 12,038,144 |
| Maximum User I/O | — | 612 |
| Transceiver Data Rate (max) | — | 5 Gbps |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Package Type | — | FBGA (Fine-pitch BGA, flip-chip) |
| Package Code | — | HBGA |
| Programmable Logic Device Type | — | FPGA |
| Hardened PCIe IP | — | PCI Express Gen2 x1/x4 |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |