EP2AGX45CU17I3G vs EP2AGX45CU17C5G Comparación
Comparación detallada lado a lado de EP2AGX45CU17I3G por Intel y EP2AGX45CU17C5G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45CU17I3G | EP2AGX45CU17C5G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $445,00 | $228,50 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | 9 |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to 85C (Commercial, TJ) |
| Encapsulado | 358-ball UBGA (FCBGA), 17x17 mm | 358-LFBGA / FCBGA (U358) |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Nivel MSL | 3 (168 hours) | — |
| Estado RoHS | Compliant | Compliant |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements (LEs) | — | 42959 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Bits | — | 3517440 |
| Number of User I/Os | — | 156 |
| Package Code | — | U358 |
| Supply Voltage Core | — | 0.9 V (nominal) |
| Speed Grade | — | -C5 (speed grade 5) |
| Lead-Free / Halogen-Free | — | Pb-free (G suffix) |
| Configuration Memory | — | SRAM-based (volatile, external config device required) |