EP2AGX45DF25C4N vs EP2AGX45DF25C4G Comparación
Comparación detallada lado a lado de EP2AGX45DF25C4N por Intel y EP2AGX45DF25C4G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF25C4N | EP2AGX45DF25C4G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $460,00 | $205,00 |
| Family | Arria II GX | EP2AGX (Arria II GX) |
| Series | EP2AGX45 | Arria II GX |
| Logic Elements | 42,959 | 45000 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total Embedded RAM Bits | 3,517,440 | — |
| M9K Memory Blocks | 273 | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/O Pins | 252 | — |
| Maximum User I/O (per datasheet) | 252 (FBGA-572 device) | — |
| Transceivers | 16 channels (data rates up to 3.75 Gbps, per family) | [DATA_NEEDED: transceiver count and data rate] |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Maximum Operating Frequency | 500 MHz (per third-party listing) | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Temperatura de funcionamiento | 0C to +85C (commercial, 'C' grade) | — |
| Speed Grade | C4 | C4 (-4 speed grade) |
| Encapsulado | 572-ball FC-FBGA (DF25) | 572-BGA, FCBGA |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant (Pb-free 'N' suffix) | — |
| Configuration Interface | Serial / JTAG | — |
| Embedded Memory Bits | — | 3517440 |
| Adaptive Logic Modules | — | 42959 |
| Number of I/O | — | 252 |
| Package Code | — | DF25 (1.0 mm pitch) |
| Process Node | — | 40 nm |
| Lead Free / RoHS | — | Yes (suffix G = lead-free) |
| User I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| DSP Blocks | — | [DATA_NEEDED: DSP block count for EP2AGX45] |