EP2AGX45DF25I3G vs EP2AGX45DF25C6N Comparación
Comparación detallada lado a lado de EP2AGX45DF25I3G por Intel y EP2AGX45DF25C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF25I3G | EP2AGX45DF25C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $370,00 | $263,50 |
| Family | Arria II GX | — |
| Logic Elements (LE) | 42,959 | — |
| Adaptive Logic Modules (ALM) | 17,715 | — |
| Embedded Memory Bits | 3,517,440 bits | — |
| Embedded Memory M9K Blocks | [DATA_NEEDED: M9K block count] | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Maximum User I/O Pins | 252 | — |
| Transceiver Channels | [DATA_NEEDED: MGT channel count] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Encapsulado | 572-ball FCBGA (HBGA) | 572-FCBGA (UBGA-358 pin variant per datasheet summary) |
| Package Dimensions | 25 mm x 25 mm | — |
| Rango de temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | C6 (commercial) |
| Process Node | 40 nm | 40 nm |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| Hard IP for PCIe | PCIe Gen1/Gen2 endpoints and root ports | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Device Family | — | Arria II GX |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs/CLBs) | — | 1,805 |
| Total Block Memory | — | 2,898 Kbit |
| User I/Os | — | 252 |
| Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Core Voltage | — | 0.9 V |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |