EP2AGX45DF29I3NAD vs EP2AGX45DF29C6N Comparación
Comparación detallada lado a lado de EP2AGX45DF29I3NAD por Intel y EP2AGX45DF29C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29I3NAD | EP2AGX45DF29C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $285,10 | $175,00 |
| Family | Arria II GX | — |
| Logic Elements | 42,959 | 45,000 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Embedded RAM Bits | 3,517,440 | — |
| User I/Os | 364 | — |
| Encapsulado | 780-ball FBGA (FineLine BGA) | 780-FBGA (DF29), 29 mm body |
| Process Node | 40 nm | — |
| Transceivers | Multi-gigabit transceivers integrated | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| Multipliers (18x18) | 156 (typical) | — |
| Speed Grade | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) | C6 |
| Temperature Grade | Industrial (I) | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Core Voltage | [DATA_NEEDED: VCCINT typical value] | 0.9 V |
| Device Family | — | Arria II GX |
| Number of LABs | — | 1,805 |
| Embedded Memory Bits | — | 3,517,440 bits |
| Total Block Memory Bits | — | [DATA_NEEDED: dedicated block memory bits] |
| User I/O Count | — | 364 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Process Technology | — | 40 nm |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Pb-Free / Lead-Free | — | Yes |