EP2AGX45DF29I5N vs EP2AGX45DF29C6N Comparación
Comparación detallada lado a lado de EP2AGX45DF29I5N por Intel y EP2AGX45DF29C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29I5N | EP2AGX45DF29C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $318,00 | $175,00 |
| Device Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | 45,000 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Embedded Memory (M9K blocks) | 3,517,440 bits | — |
| User I/Os | 364 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | [DATA_NEEDED: number of transceiver channels] | — |
| Max Transceiver Data Rate | 3.75 Gbps | — |
| PLLs | 4 | — |
| Process Technology | 40 nm | 40 nm |
| Core Supply Voltage | 0.9 V | — |
| Temperatura de funcionamiento | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Number of LABs | — | 1,805 |
| Embedded Memory Bits | — | 3,517,440 bits |
| Total Block Memory Bits | — | [DATA_NEEDED: dedicated block memory bits] |
| User I/O Count | — | 364 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Core Voltage | — | 0.9 V |
| Encapsulado | — | 780-FBGA (DF29), 29 mm body |
| Speed Grade | — | C6 |
| Pb-Free / Lead-Free | — | Yes |