EP2AGX45DF29I5N vs EP2AGX45DF29I5 Comparación
Comparación detallada lado a lado de EP2AGX45DF29I5N por Intel y EP2AGX45DF29I5 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29I5N | EP2AGX45DF29I5 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $318,00 | $285,00 |
| Device Family | Arria II GX | — |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | 1,805 |
| Embedded Memory (M9K blocks) | 3,517,440 bits | — |
| User I/Os | 364 | 364 |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | [DATA_NEEDED: number of transceiver channels] | 8 full-duplex channels |
| Max Transceiver Data Rate | 3.75 Gbps | — |
| PLLs | 4 | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | 0.9 V |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40C to +100C (industrial, I5 speed grade) |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Device Logic Elements | — | 42,959 |
| Embedded Memory (bits) | — | 3,517,440 |
| 18x18 Multipliers | — | 564 |
| Transceiver Data Rate (max) | — | 3.75 Gbps |
| Hard PCIe Gen2 IP Block | — | 1 x PCIe Gen2 x4 |
| Process Node | — | 40 nm (TSMC) |
| Encapsulado | — | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |