EP2AGX45DF29I6N vs EP2AGX45DF29C5G Comparación
Comparación detallada lado a lado de EP2AGX45DF29I6N por Intel y EP2AGX45DF29C5G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29I6N | EP2AGX45DF29C5G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $185,00 | $335,00 |
| Device Family | Arria II GX | — |
| Device Sub-family | EP2AGX45 | — |
| Logic Elements | 42,960 | — |
| Embedded Memory | 1,728 Kbits (M9K + M144K) | — |
| User I/O Pins | 364 | — |
| Transceiver Channels | 8 (up to 6.375 Gbps) | 8 |
| Hard PCIe IP | PCIe Gen1/Gen2 x1/x4 endpoints | — |
| Hard Memory Controller | DDR3 (with soft PHY) | — |
| Encapsulado | 780-ball FCBGA (FineLine BGA, DF29 pin-out) | 780-ball FC-FBGA (29 mm x 29 mm) |
| Speed Grade | 6 (fastest transceiver bin) | C5 |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Process Node | 40 nm TSMC | 40 nm TSMC low-power |
| Logic Element Structure | 8-input ALM (Adaptive Logic Module) | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Arria II GX |
| Logic Elements (LE) | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Core Voltage (typ.) | — | 0.9 V |
| Temperatura de unión de funcionamiento | — | 0°C to 85°C (Commercial) |
| Lead Finish | — | Pb-free (G suffix) |
| Configuration Memory | — | SRAM-based (volatile) |
| Hard Memory Controllers | — | DDR3 / DDR2 / QDR II+ / QDR II |
| PCI Express Hard IP | — | Gen1/Gen2 (PIPE) |
| DSP 18x18 Multipliers | — | Up to 156 |
| PLLs | — | On-die (multiple) |