EP2AGX65DF29C4G vs EP2AGX65DF29C5G Comparación
Comparación detallada lado a lado de EP2AGX65DF29C4G por Intel y EP2AGX65DF29C5G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX65DF29C4G | EP2AGX65DF29C5G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $219,00 | $245,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 60,214 | 60,214 |
| Adaptive Logic Modules (ALMs) | 30,107 | — |
| Embedded Memory | 5,371,904 bits | — |
| Number of LABs/CLBs | 2,530 | — |
| User I/O Count | 364 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | up to 3.75 Gbps (6.5536 Gbps with -4 grade using CPRI mode) | — |
| Core Voltage | 0.9 V | 0.9 V (0.87 V to 0.93 V) |
| Operating Frequency | 500 MHz | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Speed Grade | -4 (mid-speed) | C5 |
| Encapsulado | 780-BBGA, FCBGA (29 mm) | 780-ball FCBGA (FineLine BGA, 29 mm) |
| Process Node | 40 nm (Arria II generation) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating] |
| Logic Array Blocks (LABs) | — | 2,530 |
| Total RAM Bits | — | 5,371,904 |
| User I/O Pins | — | 364 |
| Process Technology | — | 40 nm |
| Temperature Range (Junction) | — | 0 °C to 85 °C (commercial) |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Transceivers | — | Up to 12 (data rate up to 6.375 Gbps) |