EP2AGX65DF29C6 vs EP2AGX65DF29I3G Comparación
Comparación detallada lado a lado de EP2AGX65DF29C6 por Intel y EP2AGX65DF29I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX65DF29C6 | EP2AGX65DF29I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $440,00 | $895,00 |
| Family | Arria II GX | Arria II |
| Logic Elements (LE) | 60,214 | 60,214 |
| Logic Array Blocks (LABs) | 2,530 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 5,371,904 | — |
| Maximum User I/O | 364 | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Transceivers | 8 (up to 3.75 Gbps per Arria II GX family spec) | Up to 8 channels, 3.75 Gbps (I3 grade) |
| PLLs | 4 | — |
| Core Voltage | 0.9 V | 0.85V / 1.1V |
| Process Technology | 40 nm | 40nm TSMC |
| Speed Grade | 6 (C6) | I3 |
| Temperatura de funcionamiento | Commercial (0C to +85C) | -40C to +100C (Industrial, I3 speed grade) |
| Encapsulado | 780-ball FC-FBGA (29x29 mm) | 780-BBGA, FCBGA (29mm) |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL Level] |
| Estado RoHS | Compliant | Compliant |
| Series | — | Arria II GX |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Memory Bits | — | 5,371,904 |
| User I/Os | — | 364 |
| Configuration Mode | — | JTAG / Passive Serial / Fast Passive Parallel / EPCS/EPCQ flash |