EP2AGX65DF29I3G vs EP2AGX65DF29I3N Comparación
Comparación detallada lado a lado de EP2AGX65DF29I3G por Intel y EP2AGX65DF29I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX65DF29I3G | EP2AGX65DF29I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $895,00 | $175,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II | Intel FPGA (formerly Altera Arria II GX) |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 60,214 | 60214 |
| Embedded Memory Bits | 5,371,904 | — |
| User I/Os | 364 | — |
| Encapsulado | 780-BBGA, FCBGA (29mm) | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I3 speed grade) | -40 C to +100 C (Industrial) |
| Speed Grade | I3 | -3 |
| Transceivers | Up to 8 channels, 3.75 Gbps (I3 grade) | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| Core Voltage | 0.85V / 1.1V | 0.9 V |
| Process Technology | 40nm TSMC | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant (Pb-free N suffix) |
| Nivel MSL | [DATA_NEEDED: MSL Level] | — |
| Configuration Mode | JTAG / Passive Serial / Fast Passive Parallel / EPCS/EPCQ flash | — |
| Process Node | — | 40 nm TSMC low-power |
| Number of LABs/CLBs | — | 2530 |
| Embedded Memory (bits) | — | 5371904 |
| Total RAM Bits | — | 5,371,904 |
| User I/O Count | — | 364 |
| Operating Frequency (max) | — | 500 MHz |
| Configuration Method | — | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |