EP2AGX65DF29I5G vs EP2AGX65DF29C6N Comparación
Comparación detallada lado a lado de EP2AGX65DF29I5G por Intel y EP2AGX65DF29C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX65DF29I5G | EP2AGX65DF29C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $689,49 | $218,75 |
| Series | Arria II GX | — |
| Family | Arria II | Arria II GX |
| Logic Elements (LE) | 60,214 | 60,214 |
| Embedded Memory | 5,371,904 bits | 5,371,904 bits |
| Logic Array Blocks (LABs) | 2,530 | 2,530 |
| User I/O Count | 364 | — |
| DSP Blocks | 17 (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 8 channels up to 6.3125 Gbps | — |
| Hard PCIe Controllers | 2 (Gen1/Gen2, endpoint + root port) | — |
| Process Technology | 40 nm TSMC | 40 nm CMOS |
| Core Voltage | 0.9 V | 0.9 V |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVDS, LVTTL, LVCMOS) | — |
| Encapsulado | 780-ball FCBGA (Flip-Chip BGA), 29 mm x 29 mm | 780-FBGA, FCBGA (29 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (FBGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to +85C (commercial, C-grade) |
| Configuration Modes | FPP, AS, JTAG, PS | — |
| Security | AES-256 bitstream encryption | — |
| Estado RoHS | Compliant | Compliant |
| User I/Os | — | 364 |
| Transceiver Count | — | 12 (max) |
| Transceiver Data Rate | — | Up to 3.75 Gbps |
| Number of Pins/ Balls | — | 780 |
| Speed Grade | — | 6 (C6) |
| Embedded Multipliers | — | Yes (18x18) |
| Hard PCIe Controller | — | PCI Express Gen2 (x1/x4/x8) |