EP2AGX95DF25C6G vs EP2AGX95DF25C6N Comparación
Comparación detallada lado a lado de EP2AGX95DF25C6G por Intel y EP2AGX95DF25C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX95DF25C6G | EP2AGX95DF25C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $290,00 | $1.750,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 89,178 | 89,178 |
| Adaptive Logic Modules (ALM) | 35,600 (estimated) | — |
| Embedded Memory Bits | 6,839,296 bits | 6,839,296 |
| Embedded Memory Type | M9K + M144K blocks | — |
| DSP Blocks | Variable-precision (estimated 88 to 176) | — |
| User I/O | 260 | — |
| Transceivers | Up to 12 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | up to 3.125 Gbps |
| Hard Memory Controller | Yes (DDR3, DDR2, QDRII+) | — |
| PLL | Up to 8 (per family datasheet) | — |
| Process Node | 40 nm | — |
| Encapsulado | 572-ball FCBGA, 25x25 mm | 572-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | -6 (fastest commercial) | 6 |
| Temperatura de funcionamiento | 0C to 85C (commercial, junction) | — |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Logic Array Blocks (LAB) | — | 3,747 |
| Maximum User I/Os | — | 260 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Maximum Operating Frequency | — | 400 MHz |
| Operating Temperature Grade | — | Commercial (C) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| Tipo de montaje | — | Surface Mount |