EP2AGX95DF25I5N vs EP2AGX95DF25I3G Comparación
Comparación detallada lado a lado de EP2AGX95DF25I5N por Intel y EP2AGX95DF25I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX95DF25I5N | EP2AGX95DF25I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $636,37 | $1.020,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 89,178 | 89,178 |
| Logic Array Blocks (LABs) | 3,747 | — |
| Embedded Memory (M9K blocks) | 4,486 Kbits | — |
| Maximum User I/O | 260 | — |
| Total Transceiver Channels | [DATA_NEEDED: transceiver channels] | — |
| Maximum Transceiver Data Rate | [DATA_NEEDED: transceiver data rate] | — |
| Process Node | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Maximum Internal Clock Frequency | 500 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Encapsulado | 572-ball FCBGA (DF25), 25x25 mm | 572-ball FCBGA |
| Tipo de montaje | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Estado RoHS | RoHS Compliant | Compliant |
| Lead Free Status | Lead Free | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Design Software | Quartus II (legacy) | — |
| Embedded Memory Bits | — | 6,839,296 |
| User I/O Count | — | 260 |
| Speed Grade | — | I3 |
| Temperature Grade | — | Industrial |
| Temperatura de funcionamiento | — | -40C to +100C |
| Lead-Free | — | Yes |
| Transceiver Count | — | [DATA_NEEDED: transceiver count per speed grade] |
| Maximum User I/O Voltage | — | [DATA_NEEDED: I/O bank supply range] |
| Configuration Method | — | Serial/Parallel via Altera Quartus II |