EP2AGX95EF29C4G vs EP2AGX95EF29C6G Comparación
Comparación detallada lado a lado de EP2AGX95EF29C4G por Intel y EP2AGX95EF29C6G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX95EF29C4G | EP2AGX95EF29C6G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $980,00 | $465,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 89,178 | 89,178 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 6,839,296 | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| DSP Blocks | [DATA_NEEDED: hard DSP block count] | — |
| Maximum User I/Os | 372 | — |
| Transceivers | Up to 12 | Up to 12 (3.75 Gbps) |
| Transceiver Data Rate | Up to 3.75 Gbps | — |
| Encapsulado | 780-pin FCBGA (flip-chip BGA) | — |
| Speed Grade | -4 | 6 |
| Temperature Grade | Commercial (0C to +85C) | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal] | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Embedded Memory | — | 4,494 Kbits |
| Number of I/O | — | 372 |
| Supply Voltage - Core | — | 0.87 V to 0.93 V |
| Temperatura de funcionamiento | — | 0C to +85C (TJ) |
| Encapsulado / Carcasa | — | 780-BBGA, FCBGA |
| Package Code | — | HBGA (FC-FBGA) |
| Package Width | — | 29 mm |
| LABs | — | 3,747 |
| PLLs | — | 8 |