EP2AGX95EF35C6G vs EP2AGX95EF35I3G Comparación
Comparación detallada lado a lado de EP2AGX95EF35C6G por Intel y EP2AGX95EF35I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX95EF35C6G | EP2AGX95EF35I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $280,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Product Family | Arria II GX | — |
| Logic Elements | 89,178 | 89,178 |
| Embedded Memory | 6,839,296 bits | — |
| User I/O | 452 | — |
| Encapsulado | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Package Type | Ball Grid Array | — |
| Manufacturer | Altera / Intel | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature] | -40C to +100C (Industrial) |
| Frecuencia de reloj máxima | [DATA_NEEDED: maximum clock frequency] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | Up to 12 channels |
| Transceiver Data Rate | [DATA_NEEDED: transceiver data rate] | — |
| Power Dissipation | [DATA_NEEDED: power dissipation] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Series | — | Arria II GX |
| Total RAM Bits | — | 6,839,296 |
| Number of LABs/CLBs | — | 452 |
| User I/O Count | — | 452 |
| Tipo de montaje | — | Surface Mount |
| Tensión de alimentación | — | 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| DSP Blocks | — | 484 (18x18 multipliers) |
| Embedded Hard IP | — | PCI Express Gen1/Gen2 endpoint/root-port |
| Memory Interfaces | — | DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+ |
| Process Technology | — | 40 nm TSMC |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |