EP2AGX95EF35I3G vs EP2AGX95EF35I3 Comparación
Comparación detallada lado a lado de EP2AGX95EF35I3G por Intel y EP2AGX95EF35I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX95EF35I3G | EP2AGX95EF35I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $280,00 | $1.440,00 |
| Series | Arria II GX | — |
| Logic Elements | 89,178 | 89,178 |
| Total RAM Bits | 6,839,296 | — |
| Number of LABs/CLBs | 452 | — |
| User I/O Count | 452 | 452 |
| Encapsulado | 1152-BBGA, FCBGA | 1152-ball FCBGA |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Tensión de alimentación | 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O | — |
| Transceiver Count | Up to 12 channels | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | 484 (18x18 multipliers) | 18x18 multipliers |
| Embedded Hard IP | PCI Express Gen1/Gen2 endpoint/root-port | — |
| Memory Interfaces | DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+ | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Arria II GX |
| Embedded Memory Bits | — | 6,839,296 |
| Core Voltage | — | 0.9 V |
| Operating Frequency (max) | — | 500 MHz |
| Temperature Grade | — | Industrial (I3) |
| Junction Temperature | — | -40 °C to +100 °C |
| Transceivers | — | Up to 16 (6.375 Gbps) |
| External Memory Support | — | DDR2/DDR3 |