EP2AGZ225FF35C3N vs EP2AGZ225HF40C3N Comparación
Comparación detallada lado a lado de EP2AGZ225FF35C3N por Intel y EP2AGZ225HF40C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225FF35C3N | EP2AGZ225HF40C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.200,00 | $1.820,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | — |
| Logic Array Blocks (LAB) | 8,960 | — |
| Embedded Memory (bits) | 14,248,960 | 14248960 |
| User I/Os | 554 | — |
| Encapsulado | 1152-BBGA, FCBGA | — |
| Process Node | 40 nm | 40 nm |
| Speed Grade | 3 | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Transceivers | Up to 12.5 Gbps | [DATA_NEEDED: transceiver count] |
| DSP Blocks | Yes (variable-precision) | [DATA_NEEDED: DSP block count] |
| Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| PCI Express Hard IP | Gen1, Gen2 | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Logic Elements | — | 224000 |
| Logic Array Blocks (LABs) | — | 8960 |
| User I/O Pins | — | 734 |
| Número de pines | — | 1517 |
| Package Type | — | 1517-BBGA, FCBGA (HF40) |
| Nivel MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Operating Temperature Grade | — | Industrial |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Core Voltage | — | [DATA_NEEDED: core voltage] |