EP2AGZ225FF35I3N vs EP2AGZ225FF35C3N Comparación
Comparación detallada lado a lado de EP2AGZ225FF35I3N por Intel y EP2AGZ225FF35C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225FF35I3N | EP2AGZ225FF35C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.655,00 | $2.200,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | 224,000 |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Encapsulado | 1152-ball FC-FBGA | 1152-BBGA, FCBGA |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Logic Array Blocks (LAB) | — | 8,960 |
| Embedded Memory (bits) | — | 14,248,960 |
| User I/Os | — | 554 |
| Process Node | — | 40 nm |
| Speed Grade | — | 3 |
| Temperature Grade | — | Commercial (0C to +85C) |
| Transceivers | — | Up to 12.5 Gbps |
| DSP Blocks | — | Yes (variable-precision) |
| Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |
| PCI Express Hard IP | — | Gen1, Gen2 |