EP2AGZ225FF35I4N vs EP2AGZ225FF35I3N Comparación
Comparación detallada lado a lado de EP2AGZ225FF35I4N por Intel y EP2AGZ225FF35I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225FF35I4N | EP2AGZ225FF35I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.390,00 | $2.655,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LEs) | 224000 | — |
| Number of LABs/CLBs | 8960 | — |
| Total Memory Bits | 14248960 | — |
| Number of I/O | 554 | — |
| Supply Voltage - Core | 0.9 V | — |
| Process Technology | 40 nm | 40 nm |
| Maximum Operating Frequency | 500 MHz | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Encapsulado / Carcasa | 1152-BBGA, FCBGA | — |
| Package Dimensions | 35 mm x 35 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead Free / RoHS | Lead Free / RoHS Compliant | — |
| Nivel MSL | [DATA_NEEDED: MSL Level] | [DATA_NEEDED: MSL rating] |
| Temperature Grade | Industrial (I4) | — |
| Logic Elements (LE) | — | 224,000 |
| Embedded Memory | — | 14,248,960 bits (approx. 14.25 Mbit) |
| Logic Array Blocks (LABs) | — | 8,960 |
| User I/O Count | — | 554 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Transceiver Channels | — | 24 |
| Core Voltage | — | 0.9 V |
| Encapsulado | — | 1152-ball FC-FBGA |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| Configuration Method | — | SRAM-based (volatile, requires external config device) |
| Maximum User I/O | — | 554 |