EP2AGZ225HF40C3G vs EP2AGZ350HF40C3G Comparación
Comparación detallada lado a lado de EP2AGZ225HF40C3G por Intel y EP2AGZ350HF40C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2AGZ225HF40C3G - 225K LE Arria II GZ FPGA, 734 I/O, FBGA-1517 | Intel
EP2AGZ225HF40C3G ✓ ActivoIntel
EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel
EP2AGZ350HF40C3G ✓ ActivoComparación de especificaciones
| Parámetro | EP2AGZ225HF40C3G | EP2AGZ350HF40C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.450,00 | $1.380,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 225,000 | — |
| User I/O Count | 734 | — |
| Encapsulado | 1517-ball FBGA (HF40) | 1517-ball FineLine BGA (HF40) |
| Process Technology | 40 nm | — |
| Temperatura de funcionamiento | Commercial (0C to +85C) | Commercial (0C to 85C, suffix 0C) |
| Speed Grade | C3 | C3 (commercial, -3) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Tensión de alimentación | [DATA_NEEDED: core voltage] | — |
| Embedded Memory | [DATA_NEEDED: total Mbits] | [DATA_NEEDED: total embedded memory bits] |
| DSP Blocks | [DATA_NEEDED: count and width] | [DATA_NEEDED: DSP block count and 18x18 multiplier count] |
| Transceivers | [DATA_NEEDED: count and max data rate] | Up to 6.375 Gbps (channel count [DATA_NEEDED]) |
| PCIe Hard IP | [DATA_NEEDED: PCIe Gen1/Gen2 lanes] | — |
| Configuration Scheme | [DATA_NEEDED: AS, PS, JTAG] | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| Lead-Free | Yes | Yes |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LEs) | — | 350,000 |
| User I/O Pins | — | 734 |
| Package Pitch | — | 1.0 mm |
| Process Node | — | 40 nm |
| External Memory Interfaces | — | DDR3, DDR2, QDR II+ (up to 800 MHz) |
| PCI Express Hard Blocks | — | Yes (Gen1/Gen2) |