EP2AGZ225HF40C4N vs EP2AGZ225FF35I4N Comparación
Comparación detallada lado a lado de EP2AGZ225HF40C4N por Intel y EP2AGZ225FF35I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225HF40C4N | EP2AGZ225FF35I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.410,00 | $1.390,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 224,000 | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| Adaptive Logic Modules (ALMs) | 89,600 | — |
| Embedded Memory Bits | 14,248,960 | — |
| User I/O Pins | 734 | — |
| Number of Package Pins | 1517 | — |
| Package Type | FBGA (FineLine BGA) | — |
| Package Code | HF40 | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Temperature Range | -40C to +85C | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | Yes (18x19 multiplier mode) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant | — |
| Logic Elements (LEs) | — | 224000 |
| Number of LABs/CLBs | — | 8960 |
| Total Memory Bits | — | 14248960 |
| Number of I/O | — | 554 |
| Supply Voltage - Core | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Encapsulado / Carcasa | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 mm x 35 mm |
| Lead Free / RoHS | — | Lead Free / RoHS Compliant |
| Nivel MSL | — | [DATA_NEEDED: MSL Level] |
| Temperature Grade | — | Industrial (I4) |