EP2AGZ225HF40C4N vs EP2AGZ225HF40C3N Comparación
Comparación detallada lado a lado de EP2AGZ225HF40C4N por Intel y EP2AGZ225HF40C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225HF40C4N | EP2AGZ225HF40C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.410,00 | $1.820,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 224,000 | 224000 |
| Logic Array Blocks (LABs) | 8,960 | 8960 |
| Adaptive Logic Modules (ALMs) | 89,600 | — |
| Embedded Memory Bits | 14,248,960 | — |
| User I/O Pins | 734 | 734 |
| Number of Package Pins | 1517 | — |
| Package Type | FBGA (FineLine BGA) | 1517-BBGA, FCBGA (HF40) |
| Package Code | HF40 | — |
| Operating Temperature Grade | Commercial (0C to +85C) | Industrial |
| Temperature Range | -40C to +85C | — |
| Process Node | 40 nm | 40 nm |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | Yes (18x19 multiplier mode) | [DATA_NEEDED: DSP block count] |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant | — |
| Embedded Memory (bits) | — | 14248960 |
| Número de pines | — | 1517 |
| Nivel MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Estado RoHS | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Transceivers | — | [DATA_NEEDED: transceiver count] |
| Core Voltage | — | [DATA_NEEDED: core voltage] |