EP2AGZ225HF40C4N vs EP2AGZ350HF40C4N Comparación
Comparación detallada lado a lado de EP2AGZ225HF40C4N por Intel y EP2AGZ350HF40C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ225HF40C4N | EP2AGZ350HF40C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.410,00 | $3.540,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 224,000 | 348,500 |
| Logic Array Blocks (LABs) | 8,960 | 13,940 |
| Adaptive Logic Modules (ALMs) | 89,600 | — |
| Embedded Memory Bits | 14,248,960 | 21,270,528 (~21.27 Mbit) |
| User I/O Pins | 734 | 734 |
| Number of Package Pins | 1517 | — |
| Package Type | FBGA (FineLine BGA) | — |
| Package Code | HF40 | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Temperature Range | -40C to +85C | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | Yes (18x19 multiplier mode) | Yes (18 x 18 multipliers, per family datasheet) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant | — |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.9 V |
| Speed Grade | — | C4 |
| Temperature Grade | — | Commercial (0C to +85C) |
| Encapsulado | — | 1517-ball FC-FBGA (HF40, 40 x 40 mm) |
| Transceivers | — | Up to 24 channels, up to 6.375 Gbps (per family datasheet) |
| PLLs | — | Fractional and integer PLLs (per family datasheet) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Estado RoHS | — | Compliant (per Altera/Intel product page) |