EP2AGZ300FF35C3N vs EP2AGZ300FF35C4N Comparación
Comparación detallada lado a lado de EP2AGZ300FF35C3N por Intel y EP2AGZ300FF35C4N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FF35C3N | EP2AGZ300FF35C4N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.480,00 | $1.350,00 |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | 11,920 |
| Embedded Memory (Bits) | 18,854,912 | — |
| User I/Os | 554 | — |
| Maximum User I/O Pins (Package) | 1,152 | — |
| 18x18 Multipliers | 554 | — |
| Transceivers | Up to 16 channels | Multi-gigabit transceivers integrated |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| PLLs | 8 | [DATA_NEEDED: PLL count] |
| Encapsulado | 1152-ball FCBGA (FF35) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Operating Temperature Grade | Commercial | Commercial (C4 = 0C to +85C) |
| Series | — | Arria II GZ |
| Logic Elements | — | 298,000 |
| Embedded Memory (bits) | — | 18,854,912 (~17.9 Mbit) |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Package Type | — | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Estado RoHS | — | Compliant (per Besenchips / DigiKey listing) |
| Lead-Free Status | — | Lead free (per Besenchips listing) |
| Maximum Operating Frequency | — | 500 MHz |