EP2AGZ300FF35I4G vs EP2AGZ300FF35C4N Comparación
Comparación detallada lado a lado de EP2AGZ300FF35I4G por Intel y EP2AGZ300FF35C4N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FF35I4G | EP2AGZ300FF35C4N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.610,00 | $1.350,00 |
| Series | Arria II GZ | Arria II GZ |
| Family Name | Arria II GZ FPGA | — |
| Logic Elements (LE) | 300,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 18.16 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: number of DSP blocks] |
| Maximum User I/O | 554 | — |
| Transceivers | Up to 21 channels | Multi-gigabit transceivers integrated |
| Transceiver Data Rate | 8.55 Gbps | — |
| Hard PCIe Controllers | PCIe Gen1 and Gen2 | — |
| Memory Interfaces | DDR3, DDR2, QDRII+, QDRII SRAM up to 800 MHz | — |
| PLLs | Fractional PLLs on-chip | [DATA_NEEDED: PLL count] |
| Encapsulado | 1152-FBGA (FF35) 35x35 mm | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I4 grade) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | Compliant (per Besenchips / DigiKey listing) |
| Process Node | 40 nm | — |
| Speed Grade | 4 | — |
| Logic Elements | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory (bits) | — | 18,854,912 (~17.9 Mbit) |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Package Type | — | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Operating Temperature Grade | — | Commercial (C4 = 0C to +85C) |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| Lead-Free Status | — | Lead free (per Besenchips listing) |
| Maximum Operating Frequency | — | 500 MHz |