EP2AGZ300FF35I4N vs EP2AGZ300FF35I3G Comparación
Comparación detallada lado a lado de EP2AGZ300FF35I4N por Intel y EP2AGZ300FF35I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FF35I4N | EP2AGZ300FF35I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.925,00 | $1.230,00 |
| Series | Arria II GZ | — |
| Family | Field Programmable Gate Array (FPGA) | Arria II GZ |
| Logic Elements | 298,000 | — |
| Number of LABs/CLBs | 11,920 | — |
| Total RAM Bits | 18,854,912 bits | — |
| Number of I/O | 554 | — |
| Supply Voltage Core | 0.9 V | — |
| Process Technology | 40 nm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40C to +100 C (I3 industrial) |
| Package Type | 1152-BBGA, FCBGA | — |
| Package Dimensions | 35 mm x 35 mm | — |
| Supplier Device Package | 1152-FBGA (35x35) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 300000 |
| Number of User I/O | — | 554 (maximum) |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Process Node | — | 40 nm |
| Encapsulado | — | 1152-ball FBGA (FF35) |
| Tensión de alimentación | — | [DATA_NEEDED: core and I/O supply voltage values] |
| Embedded Memory (Mbits) | — | 16.4 |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Configuration Method | — | Serial, Parallel, JTAG |
| Nivel MSL | — | 3 (168 hours) |