EP2AGZ300FH29C4N vs EP2AGZ300FH29I4G Comparación
Comparación detallada lado a lado de EP2AGZ300FH29C4N por Intel y EP2AGZ300FH29I4G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FH29C4N | EP2AGZ300FH29I4G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $1.350,00 |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements (LE) | 298,000 | 300,000 (approx., per family member) |
| Logic Array Blocks (LABs) | 11,920 | — |
| Adaptive Logic Modules (ALMs) | 119,200 | — |
| Embedded Memory (bits) | 18,854,912 | — |
| User I/O Pins | 281 | — |
| DSP Blocks | [DATA_NEEDED: exact DSP block count for EP2AGZ300] | Yes (variable-precision, per family) |
| Transceivers | Up to 28 (up to 6.375 Gbps) | Embedded multi-gigabit transceivers (per family) |
| Core Voltage | 0.9 V | — |
| Process Node | 40 nm | 40 nm TSMC |
| Encapsulado | 780-ball FC-HFBGA (FH29) | — |
| Speed Grade | C4 | I4 |
| Temperature Grade | Industrial (N suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Number of I/O | — | 281 |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Rango de temperatura de funcionamiento | — | -40C to +100C (industrial, I-grade) |
| Supply Voltage (Core) | — | 0.9 V (typical) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| Block RAM | — | Embedded M9K / M144K blocks |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes (per RoHS) |