EP2AGZ300FH29I3G vs EP2AGZ300FH29I4N Comparación
Comparación detallada lado a lado de EP2AGZ300FH29I3G por Intel y EP2AGZ300FH29I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FH29I3G | EP2AGZ300FH29I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.340,00 | $1.380,00 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 300,000 | — |
| Embedded Memory | 18,520 Kbits | — |
| DSP Blocks (18x18 multipliers) | 720 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Number of Transceivers | 24 | — |
| Process Node | 40 nm TSMC | — |
| Encapsulado | 780-pin FineLine BGA (FH29), 29x29 mm | 780-ball FCBGA (FH29) |
| Speed Grade | -3 | — |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Operating Voltage (Core) | 0.9 V | — |
| External Memory Interface | DDR3 up to 800 MHz | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Logic Elements | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory Bits | — | 18,854,912 |
| User I/Os | — | 281 |
| Operating Frequency (max) | — | 500 MHz |
| Process Technology | — | 40 nm CMOS |
| Core Supply Voltage | — | 0.9 V |
| Package Code | — | BGA / FC-HFBGA |
| Operating Temperature Grade | — | Industrial (I4 speed/temperature grade) |
| Lead-Free | — | Yes |
| Number of Cells | — | 298,000 |