EP2AGZ300FH29I4N vs EP2AGZ300FH29I3G Comparación
Comparación detallada lado a lado de EP2AGZ300FH29I4N por Intel y EP2AGZ300FH29I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FH29I4N | EP2AGZ300FH29I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.380,00 | $1.340,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Embedded Memory Bits | 18,854,912 | — |
| User I/Os | 281 | — |
| Operating Frequency (max) | 500 MHz | — |
| Process Technology | 40 nm CMOS | — |
| Core Supply Voltage | 0.9 V | — |
| Encapsulado | 780-ball FCBGA (FH29) | 780-pin FineLine BGA (FH29), 29x29 mm |
| Package Code | BGA / FC-HFBGA | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I4 speed/temperature grade) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Number of Cells | 298,000 | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | — | 300,000 |
| Embedded Memory | — | 18,520 Kbits |
| DSP Blocks (18x18 multipliers) | — | 720 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Number of Transceivers | — | 24 |
| Process Node | — | 40 nm TSMC |
| Speed Grade | — | -3 |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Operating Voltage (Core) | — | 0.9 V |
| External Memory Interface | — | DDR3 up to 800 MHz |