EP2AGZ300HF40C3G vs EP2AGZ300HF40I3G Comparación
Comparación detallada lado a lado de EP2AGZ300HF40C3G por Intel y EP2AGZ300HF40I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300HF40C3G | EP2AGZ300HF40I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5.950,00 | $1.995,00 |
| Series | Arria II GZ | Arria II GZ |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 300,000 | — |
| User I/O Count | 734 | — |
| Encapsulado | 1517-ball FBGA | FBGA-1517 (HF40), 45 mm body, 1 mm pitch |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| Temperatura de funcionamiento | Commercial (0C to +85C) | -40C to +100C (industrial) |
| Embedded Memory | Approx. 18.7 Mbits | 20.475 Mbits |
| DSP Blocks | 800+ (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | 40 nm TSMC |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| Estado RoHS | Pb-free finish - compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 300,000 (approx.) |
| Embedded Multipliers | — | 28 (18x18) |
| User I/O Pins | — | 734 |
| Transceiver Count | — | 24 |
| Transceiver Data Rate | — | up to 6.375 Gbps |
| Core Voltage | — | 1.2 V (typical) |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Nivel MSL | — | 3 |