EP2AGZ300HF40C3N vs EP2AGZ350HF40C3N Comparación
Comparación detallada lado a lado de EP2AGZ300HF40C3N por Intel y EP2AGZ350HF40C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300HF40C3N | EP2AGZ350HF40C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.623,45 | $2.150,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | 348,500 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | 11,920 | 13,940 |
| Total Memory Bits | 18,854,912 bits (~18.85 Mbit) | — |
| Embedded Multipliers (18x18) | 736 | — |
| Maximum User I/O | 734 | — |
| Transceivers | Up to 12 channels | Up to 24 (per family datasheet) |
| Transceiver Data Rate | Up to 6.375 Gbps | Up to 6.553 Gbps |
| Process Technology | 40 nm | 40 nm low-power |
| Core Voltage | 0.9 V | 0.9 V |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | — |
| Encapsulado | 1517-BBGA, FCBGA (Flip-Chip BGA) | 1517-ball FCBGA (HF40) |
| Memory Interface Support | DDR3-800, DDR2, QDR II+, RLDRAM II | — |
| PCIe Hard IP | PCI Express Gen1 / Gen2 | — |
| PLL Type | Fractional PLL + Multiplier PLL | — |
| Estado RoHS | Compliant | — |
| Estado del ciclo de vida | Obsolete (NRND/EOL per Intel) | — |
| Configuration Interface | JTAG, Passive Serial, Fast Passive Parallel | — |
| Design Software | Quartus II (legacy) | — |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |
| Tipo de montaje | — | Surface Mount (flip-chip BGA) |