EP2AGZ300HF40I3N vs EP2AGZ225HF40I3N Comparación
Comparación detallada lado a lado de EP2AGZ300HF40I3N por Intel y EP2AGZ225HF40I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300HF40I3N | EP2AGZ225HF40I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.820,00 | $2.210,00 |
| Series | Arria II GZ | — |
| Family | EP2AGZ | Arria II GZ |
| Logic Elements (LE) | 298,000 | 224,000 |
| Embedded Memory Bits | 18,854,912 | — |
| User I/O Count | 734 | — |
| Encapsulado | 1517-BBGA, FCBGA (HF40) | — |
| Ball Pitch | 1.0 mm | — |
| Supply Voltage (Core) | 0.9 V | [DATA_NEEDED: core voltage] |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Number of PLLs | 4 | — |
| Configuration Interface | Passive Serial / Fast Passive Parallel / JTAG | — |
| Bitstream Encryption | AES-256 | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Tipo de montaje | Surface Mount | Surface Mount |
| Embedded Memory (bits) | — | 14,248,960 |
| User I/O | — | 734 |
| Logic Array Blocks (LABs) | — | 8,960 |
| Embedded Multipliers (18x18) | — | 736 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Speed Grade | — | I3 (industrial, -3) |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Package Type | — | 1517-BBGA, FCBGA (flip-chip BGA) |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PCIe Hard IP | — | PCIe Gen1/Gen2 |