EP2AGZ300HF40I3N vs EP2AGZ300HF40I4 Comparación
Comparación detallada lado a lado de EP2AGZ300HF40I3N por Intel y EP2AGZ300HF40I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300HF40I3N | EP2AGZ300HF40I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.820,00 | $1.925,00 |
| Series | Arria II GZ | Arria II GZ |
| Family | EP2AGZ | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 298,000 | — |
| Embedded Memory Bits | 18,854,912 | — |
| User I/O Count | 734 | — |
| Encapsulado | 1517-BBGA, FCBGA (HF40) | — |
| Ball Pitch | 1.0 mm | — |
| Supply Voltage (Core) | 0.9 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial (I4): -40C to +100C |
| Process Technology | 40 nm | — |
| Number of PLLs | 4 | 8 |
| Configuration Interface | Passive Serial / Fast Passive Parallel / JTAG | — |
| Bitstream Encryption | AES-256 | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Manufacturer | — | Intel (formerly Altera) |
| Process Node | — | 40 nm |
| Logic Elements | — | 298,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 18,854,912 bits (18.85 Mbit) |
| Block RAM | — | 19,200 Kbits |
| Number of Logic Cells | — | 298,000 |
| Maximum User I/O Pins | — | 1192 |
| Number of Transceivers | — | Up to 24 |
| Transceiver Data Rate (max) | — | 6.375 Gbps (CPRI/OBSAI) |
| Core Voltage | — | 0.9 V (1.1 V option via SmartVoltage IDM) |
| Core Performance (max) | — | 500 MHz |
| Number of Global Clock Networks | — | 16 |
| Package Type | — | 1517-ball FC-FBGA |
| Lead-Free | — | Yes |