EP2AGZ350FH29C3G vs EP2AGZ300FH29C3G Comparación
Comparación detallada lado a lado de EP2AGZ350FH29C3G por Intel y EP2AGZ300FH29C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350FH29C3G | EP2AGZ300FH29C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.350,00 | $1.545,00 |
| Logic Elements | 350,000 | 300,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | — |
| Transceivers | 24 channels | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | 3 |
| Temperatura de unión de funcionamiento | 0C to +85C | — |
| Encapsulado | 780-ball FBGA (HBGA, 29x29 mm) | 780-BGA (HBGA, 29 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020, where stated) |
| Series | — | Arria II GZ |
| Manufacturer | — | Intel (Altera) |
| Number of I/O | — | 281 |
| Temperatura de funcionamiento | — | 0C to +85C (commercial, speed grade 3) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Embedded Memory | — | M9K / M144K block RAM |
| DSP Blocks | — | Yes (variable-precision DSP) |