EP2AGZ350HF40C3N vs EP2AGZ350HF40C2N Comparación
Comparación detallada lado a lado de EP2AGZ350HF40C3N por Intel y EP2AGZ350HF40C2N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350HF40C3N | EP2AGZ350HF40C2N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.150,00 | $2.645,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 350,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Dedicated 18x18 multipliers |
| Transceivers | Up to 24 (per family datasheet) | Up to 16 channels |
| Transceiver Data Rate | Up to 6.553 Gbps | Up to 6.375 Gbps |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| Encapsulado | 1517-ball FCBGA (HF40) | 1517-ball FCBGA (HF40), 40 mm x 40 mm |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount (FCBGA) |
| Embedded Memory | — | approximately 20 Mbits |
| Speed Grade | — | C2 (commercial) |
| Temperatura de funcionamiento | — | 0C to +85C (commercial, per N suffix) |
| Process Node | — | 40 nm low-power |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, differential standards |
| External Memory Support | — | DDR3, QDR II+, RLDRAM II |
| Configuration Method | — | Quartus II design suite, JTAG, passive/active serial |
| Estado RoHS | — | Compliant (per product listing) |