EP2AGZ350HF40C3N vs EP2AGZ350HF40C4N Comparación
Comparación detallada lado a lado de EP2AGZ350HF40C3N por Intel y EP2AGZ350HF40C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350HF40C3N | EP2AGZ350HF40C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.150,00 | $3.540,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 348,500 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | 13,940 |
| Embedded Memory Bits | 21,270,528 | 21,270,528 (~21.27 Mbit) |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Yes (18 x 18 multipliers, per family datasheet) |
| Transceivers | Up to 24 (per family datasheet) | Up to 24 channels, up to 6.375 Gbps (per family datasheet) |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | 40 nm |
| Encapsulado | 1517-ball FCBGA (HF40) | 1517-ball FC-FBGA (HF40, 40 x 40 mm) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount |
| User I/O Pins | — | 734 |
| Core Supply Voltage | — | 0.9 V |
| Speed Grade | — | C4 |
| Temperature Grade | — | Commercial (0C to +85C) |
| PLLs | — | Fractional and integer PLLs (per family datasheet) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Estado RoHS | — | Compliant (per Altera/Intel product page) |