EP2AGZ350HF40C3N vs EP2AGZ350HF40I2N Comparación
Comparación detallada lado a lado de EP2AGZ350HF40C3N por Intel y EP2AGZ350HF40I2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350HF40C3N | EP2AGZ350HF40I2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.150,00 | $1.380,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 350000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 24 (per family datasheet) | Embedded multi-gigabit transceivers |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| Encapsulado | 1517-ball FCBGA (HF40) | 1517-pin FBGA (HF40) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Embedded Memory | — | [DATA_NEEDED: Mbits] |
| User I/O Banks | — | [DATA_NEEDED: bank count] |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O count] |
| Process Node | — | [DATA_NEEDED: process node nm] |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| AEC-Q100 | — | not_applicable |