EP2AGZ350HF40C3N vs EP2AGZ350HF40I3 Comparación
Comparación detallada lado a lado de EP2AGZ350HF40C3N por Intel y EP2AGZ350HF40I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350HF40C3N | EP2AGZ350HF40I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.150,00 | $3.475,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 348,500 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 139,400 |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | 21,270,528 bits |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 768 (18x18 multipliers) |
| Transceivers | Up to 24 (per family datasheet) | 24 channels up to 6.375 Gbps |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm low-power | 40 nm TSMC |
| Encapsulado | 1517-ball FCBGA (HF40) | 1517-BBGA, FCBGA (HF40) 40 x 40 mm |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | — |
| Embedded Memory Blocks | — | 950 M20K blocks |
| User I/O Pins | — | 13,940 |
| Hard PCIe Controllers | — | 4 x Gen2 |
| Hard Memory Controllers | — | 8 DDR3 controllers up to 800 MHz |
| PLLs | — | 16 (8 fPLL + 8 GPLL) |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG, AES-256 |
| Estado RoHS | — | Compliant |