EP2AGZ350HF40I2N vs EP2AGZ350HF40I3N Comparación
Comparación detallada lado a lado de EP2AGZ350HF40I2N por Intel y EP2AGZ350HF40I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350HF40I2N | EP2AGZ350HF40I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.380,00 | $1.985,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 350000 | — |
| Encapsulado | 1517-pin FBGA (HF40) | 1517-ball FC-FBGA (HF40) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Transceivers | Embedded multi-gigabit transceivers | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Embedded Memory | [DATA_NEEDED: Mbits] | — |
| User I/O Banks | [DATA_NEEDED: bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Node | [DATA_NEEDED: process node nm] | — |
| Estado RoHS | Compliant | Compliant (lead-free N suffix) |
| Lead-Free | Yes | Yes |
| Tipo de montaje | Surface Mount (BGA) | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| AEC-Q100 | not_applicable | — |
| Series | — | Arria II |
| Logic Elements (LE) | — | 348500 |
| Logic Array Blocks (LABs) | — | 13940 |
| User I/O Count | — | 734 |
| Total Embedded Memory Bits | — | 21270528 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | I3 |
| Package Code | — | BGA (Ball Grid Array) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 1517 |
| Package Shape | — | Square |