EP2AGZ350HF40I3 vs EP2AGZ350HF40I2N Comparación
Comparación detallada lado a lado de EP2AGZ350HF40I3 por Intel y EP2AGZ350HF40I2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350HF40I3 | EP2AGZ350HF40I2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.475,00 | $1.380,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 350000 |
| Adaptive Logic Modules (ALMs) | 139,400 | — |
| Embedded Memory Bits | 21,270,528 bits | — |
| Embedded Memory Blocks | 950 M20K blocks | — |
| DSP Blocks | 768 (18x18 multipliers) | [DATA_NEEDED: DSP block count] |
| User I/O Pins | 13,940 | — |
| Transceivers | 24 channels up to 6.375 Gbps | Embedded multi-gigabit transceivers |
| Hard PCIe Controllers | 4 x Gen2 | — |
| Hard Memory Controllers | 8 DDR3 controllers up to 800 MHz | — |
| PLLs | 16 (8 fPLL + 8 GPLL) | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Encapsulado | 1517-BBGA, FCBGA (HF40) 40 x 40 mm | 1517-pin FBGA (HF40) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG, AES-256 | — |
| Estado RoHS | Compliant | Compliant |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Embedded Memory | — | [DATA_NEEDED: Mbits] |
| User I/O Banks | — | [DATA_NEEDED: bank count] |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O count] |
| Process Node | — | [DATA_NEEDED: process node nm] |
| Lead-Free | — | Yes |
| Tipo de montaje | — | Surface Mount (BGA) |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| AEC-Q100 | — | not_applicable |