EP2AGZ350HF40I4N vs EP2AGZ350HF40I3 Comparación
Comparación detallada lado a lado de EP2AGZ350HF40I4N por Intel y EP2AGZ350HF40I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350HF40I4N | EP2AGZ350HF40I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.280,00 | $3.475,00 |
| Series | Arria II GZ | — |
| Logic Elements (LE) | 348,500 | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory (Bits) | 21,270,528 | — |
| Maximum User I/O | 734 | — |
| Operating Frequency (max) | 500 MHz | — |
| Process Node | 40 nm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Encapsulado | 1517-ball FC-FBGA (HF40) | 1517-BBGA, FCBGA (HF40) 40 x 40 mm |
| Package Dimensions | [DATA_NEEDED: package body size in mm] | — |
| Speed Grade | I4 | — |
| Rango de temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Lead-Free / RoHS | Lead-Free / RoHS Compliant | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Hard IP Blocks | PCIe Gen2, DDR2/DDR3/QDRII+/RLDRAM II memory controllers | — |
| Design Software | Quartus II (13.0 or later) | — |
| Family | — | Arria II GZ |
| Logic Elements | — | 348,500 |
| Adaptive Logic Modules (ALMs) | — | 139,400 |
| Embedded Memory Bits | — | 21,270,528 bits |
| Embedded Memory Blocks | — | 950 M20K blocks |
| DSP Blocks | — | 768 (18x18 multipliers) |
| User I/O Pins | — | 13,940 |
| Transceivers | — | 24 channels up to 6.375 Gbps |
| Hard PCIe Controllers | — | 4 x Gen2 |
| Hard Memory Controllers | — | 8 DDR3 controllers up to 800 MHz |
| PLLs | — | 16 (8 fPLL + 8 GPLL) |
| Process Technology | — | 40 nm TSMC |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG, AES-256 |
| Estado RoHS | — | Compliant |